Active 3D optical components using 2-photon lithography

Active 3D optical components using 2-photon lithography

Scientific context :

Integrated optical/optoelectronic components on silicon generally rely on conventional manufacturing techniques derived from microelectronics (lithography/etching/deposition, etc.) to produce passive components (waveguides, filters, etc.). The integration of a light source (to create a laser) into the chip generally relies on III-V or III-N semiconductors and requires transfer/bonding techniques that are difficult to implement. In addition, these systems are mainly coplanar.

Chemical synthesis processes can be used to produce commercial light-emitting colloidal systems (quantum dots, dyes) whose size allows emission to be controlled in the spectral range extending from UV to IR. These systems can be integrated into the formulation of a photosensitive resin. In addition, the development of 3D (2-photon) lithography on this functional resin would make it possible to offer new types of active optical components. It is in this context that this internship proposal is being made.

Intership:

In the first stage, the student will be involved in the formulation of a nanocomposite resin loaded with emitters and will evaluate its performance in 2-photon lithography (resolution/morphology). They will evaluate the optical properties (photoluminescence, ellipsometric measurements, spectroscopy, etc.) of the active resin . In a second stage, they will consider the manufacture and study of innovative optical components (3D pyramid for light injection into a waveguide, ring or photonic crystal resonators, non-Hermitian photonic components, etc.).