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Job Opening: 1-Year Fixed-Term Contract at the Microelectronics Technology Laboratory

Join the LTM to work on developing rapid, non-invasive methods for qualifying end-of-life electronic components.

Job description / Employment

Background

This position is part of the LabEx Microelectronics program at Université Grenoble Alpes UGA), a center of excellence that brings together 12 laboratories (including one international laboratory) to address the technological, industrial, and environmental challenges of the next semiconductor revolution. 

Among other things, this project aims to develop innovative solutions in micro- and nanoelectronics, with a particular focus on sustainability and circular electronics.

The position will be affiliated with the chair held by Professor Jean-Pierre Raskin, who is internationally recognized for his research in advanced characterization of electronic components, system reliability, and non-invasive qualification methods. 

The candidate will contribute to the development of rapid, non-destructive characterization techniques to assess the residual quality of end-of-life electronic components and subsystems, using state-of-the-art technological platforms (nano-XRF imaging, aging test benches, X-ray microtomography, etc.).

View the job posting on the CNRS website : 

https://emploi.cnrs.fr/Offres/CDD/UMR5129-MARCLO-108/Default.aspx

Workplace: 

The Microelectronics Technology Laboratory (LTM) in Grenoble, located on the CEA-LETI-MINATEC campus.

Responsibilities: 

1 – Study of the main aging mechanisms and their effects on the performance of an integrated circuit (IC)
2 – Identification of aging and/or performance signatures that can be extracted using non-invasive and non-destructive methods, such as imaging techniques, thermal maps, power consumption, electromagnetic emission diagrams, etc. These measurements will be performed in combination with an accelerated aging protocol.
3 – Analysis of the trade-off between high-fidelity characterization, test time, cost, and the potential risk of damage to the tested integrated circuit.
4 – AI techniques can be used to extract meaningful signatures and predict the results of high-fidelity characterization (which might require slow and/or destructive measurements during a direct test) from a set of faster, simpler, and non-destructive low-fidelity measurements.

Apply :

https://emploi.cnrs.fr/Offres/CDD/UMR5129-MARCLO-108/Default.aspx

Date : March 2, 2026, to May 1, 2026

 

Submitted on April 20, 2026

Updated on April 20, 2026