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Advanced Plasma Processes

Lignes

The team is developping  innovative plasma etching and deposition processes with the objective to meet the technological needs of emerging nano- and opto-electronic devices.
To this end, we study the basic mechanisms involved in plasma processes by combining plasma analyses, process simulation/modelling and characterization of plasma/surface interactions. The strength of our research lies in the ability to develop plasma processes on 200-300mm substrates in state-of-the-art industrial etching reactors.  All the process breakthroughs are directly transferable to our industrial partners (STMicroelectronics, AMAT).

This research gathers the activity of 7 CNRS/UGA permanents:
- BONVALOT Marceline (MC, UGA)
- CUNGE Gilles (DR, CNRS)
- DESPIAU-PUJO Emilie (MC, UGA)
- JOUBERT Olivier (DR, CNRS)
- KOGELSCHATZ Martin (MC, INP)
- PARGON Erwine (DR, CNRS)
- PETIT-ETIENNE Camille (IR, CNRS)

Five main topics of research are conducted to face the challenges related to the patterning and elaboration of complex stack of materials using state-of-the-art plasma etchers and deposition tools:

Advanced plasma technologies

Contact: erwine.pargonatcea.fr (erwine[dot]pargon[at]cea[dot]fr)

Advanced plasma Etching processes

Contact: erwine.pargonatcea.fr (erwine[dot]pargon[at]cea[dot]fr)

Plasma/surface modeling

Contact: emilie.despiau-pujoatuniv-grenoble-alpes.fr (emilie[dot]despiau-pujo[at]univ-grenoble-alpes[dot]fr)

Plasma diagnostics

Contact: gilles.cungeatcea.fr (gilles[dot]cunge[at]cea[dot]fr)

Plasma enhanced atomic layer deposition processes

Contact: marceline.bonvalotatcea.fr (marceline[dot]bonvalot[at]cea[dot]fr)